High Modulus Epoxy Adhesives
Our range of High Modulus Epoxy Adhesives is engineered for demanding structural applications requiring uncompromising rigidity and exceptional load-bearing capacity. This product line is classified into specialized formulations to address specific industrial challenges. High-Strength Structural Shimming Compounds are designed for precise machinery bedding and base leveling, providing dimensional stability under heavy loads. Gap-Filling Formulations feature non-sag properties for vertical applications, effectively rebuilding worn parts on presses, molds, and industrial equipment. Precision Tooling & Mold Making grades offer minimal shrinkage and superior surface finish for producing master models and fixtures. For high-temperature environments, our Thermal-Resistant Structural Epoxies maintain stability in curing ovens and manufacturing processes. These High Modulus Epoxy Adhesives deliver exceptional compressive strength and resistance to chemicals and wear, making them ideal for industrial maintenance, metalworking, and precision manufacturing applications where structural integrity is critical.
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The Medium-High Voltage Insulation Potting Adhesive has a 10-9 ratio for optimal curing at 85C/3-5H or 105C/6-8H. This adhesive is specially formulated to provide strong insulation and protection for electrical components in medium to high voltage applications.
DY-6012 has the excellent properties of non-volatility, non-toxicity, low odor, environmental friendliness, good insulation performance; resistance to water, acid and alkali, wear resistance, excellent anti-corrosion performance, room temperature curing, and extremely strong adhesion.
DY-EP312 epoxy potting compound is ready for use at room temperature and can be heated at medium temperature. After mixing, its viscosity ranges from 13,000 to 16,000 cps. It can cure quickly at room temperature or at medium temperature, and has an appropriate curing time.
The Medium-High Voltage Insulation Potting Adhesive has a 10-9 ratio for optimal curing at 85C/3-5H or 105C/6-8H. This adhesive is specially formulated to provide strong insulation and protection for electrical components in medium to high voltage applications.
The Two Component Epoxy Glue Resin Decoration Adhesive Einecs No. 230-391-5 is a 1.6kg two component epoxy glue that is ideal for damp proofing applications. This fast curing adhesive sets in just 6 hours, making it perfect for various decoration projects.
The 30-MIN EPOXY ADHESIVE is a versatile bonding solution that is resistant to acid, alkali, and oil. Its non-flammable, non-shrinking, and waterproof properties make it ideal for black and white bonding classification, producing a metallic grey finish that can be easily filed, grinded, and drilled.
High-temperature resistant adhesive is formulated using introduced process technology, featuring non-volatile properties, low odor, high strength, excellent insulation, flame resistance, oil resistance, acid and alkali resistance. It can withstand temperatures of 120-150°C at room temperature and can endure temperatures above 180°C momentarily.
DE-5503 is a single component AB epoxy adhesive specifically designed for PET materials. With a viscosity range of 60-120 CPS and a fast curing time of 3-10 seconds, this adhesive is perfect for quick and efficient bonding applications.
High-strength epoxy rebar anchoring adhesive, two-component injection construction, suitable for embedding rebars into concrete structures, featuring ultra-high tensile pull-out strength, aging resistance, and seismic performance, meeting requirements for moisture-filled holes and rapid load-bearing.
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