DY-EP312 electronic potting compound is used for electronic sealing.
Product description
DY-EP312 epoxy potting compound is ready for use at room temperature and can be heated at medium temperature. After mixing, its viscosity ranges from 13,000 to 16,000 cps. It can cure quickly at room temperature or at medium temperature, and has an appropriate curing time.
Product advantages
It has the characteristics of being fixed, insulated, waterproof, oil-proof, dust-proof, corrosion-resistant, aging-resistant, cold and heat shock-resistant, etc. It can provide comprehensive protection for electronic components and other items, extend their service life, and ensure their normal operation in various complex environments.
Product Features
It has the characteristics of being fixed, insulated, waterproof, oil-proof, dust-proof, corrosion-resistant, aging-resistant, cold and heat shock-resistant, etc. It can provide comprehensive protection for electronic components and other items, extend their service life, and ensure their normal operation in various complex environments.
Product Effect
It can be rapidly cured at room temperature or medium temperature. After curing, it can withstand special impacts and vibrations. The subsequent layer has excellent mechanical properties and electrical insulation, and can withstand temperature changes without being corrosive.
Application Areas
Suitable for sealing and packaging electronic components such as electronic transformers, coils, magnetic cores, as well as metal, ceramic and fiber products.